Wires

Electrodes of semiconductor elements and package leads are bonded by using gold wires. Package side connections are gold-plated, having no surface oxide film. The gold bonding wire diameter is 25μm.

Gold bonding wires (From Tanaka Kikinzoku’s catalog)

Gold bonding wires

Adoption examples

Wires

Gold bonding wire
(From Tatsuta Electric Wire & Cable’s catalog)

Appearance of lead frame + device + wire
Appearance of lead frame + device + wire

Types of plating