Electrodes of semiconductor elements and package leads are bonded by using gold wires. Package side connections are gold-plated, having no surface oxide film. The gold bonding wire diameter is 25μm.
|Type & features
Gold bonding wires
(From Tanaka Kikinzoku’s catalog)
Gold bonding wire
(From Tatsuta Electric Wire & Cable’s catalog)
Appearance of lead frame + device + wire