めっき技術

Wires

Electrodes of semiconductor elements and package leads are bonded by using gold wires. Package side connections are gold-plated, having no surface oxide film. The gold bonding wire diameter is 25μm.
Type & features
wiresub1.jpg
Gold bonding wires
(From Tanaka Kikinzoku’s catalog)
採用事例
Wires
Gold bonding wire
(From Tatsuta Electric Wire & Cable’s catalog)
Appearance of lead frame + device + wire
Appearance of lead frame + device + wire

 

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