Heat treatment related to plating technologies include  baking treatment for the purpose of preventing hydrogen brittleness by plating,  reflow (remelting) treatment for the purpose of preventing whisker occurrence, and  heat treatment to enhance the hardness and wear resistance of plating films. It is advantageous to improve the reliability of plating films and make them more functional.
|Type of plating
||Features (characteristic value)
||- Heat treatment conditions to remove hydrogen brittleness (in the case of zinc plating/high-tensile steel materials)
|Tensile strength (kgf/mm2)
||Heat treatment temperature × time
|105 – 145
||190 – 220°C × 8hr or more
|145 – 180
||190 – 220°C × 18hr or more
|More than 180
||190 – 220°C × 24hr or more
- Heat treatment to improve adhesion properties (in the case of electroless nickel-phosphorus plating)
||210 ± 10°C × 1 - 1.5 hr
||190 ± 10°C × 1 - 1.5 hr
||130 ± 10°C × 1- 1.5 hr
|Reflow (remelting) treatment
||- Melting at a temperature somewhat higher than the melting point (232°C) to reliably remove internal stress for the purpose of preventing whisker occurrence in tin-based plating films.
||Heat treatment is performed after plating to enhance the hardness and wear resistance of plating films (mainly amorphous plating).
|Heat treatment temperature (°C) held for 1 hour
|Without heat treatment
Reflow treatment of tin plating
[Types of plating]
[Materials & uses]